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TU-872LKSp

LowDk/DfandHighThermalReliabilityMaterials

Core:TU-872LKSp;Prepreg:TU-87PLKSp

terialisreinforced

withnovelwovenglassanddesignedwithextralowdielectricconstantandlowdissipationfactorforhigh

-872LKSpmaterialissuitable

forenvironme-872LKSp

laminatesalsoexhibitexcellentCTE,superiorchemicalresistance,thermalstability,CAFresistance,and

toughnessenhancedbyanallylnetworkformingcompound.

MainApplications

RatioFrequency

Backpanel,Highperformancecomputing

Linecards,Storage

Servers,Telecom,Basestation

OfficeRouters

KeyFeatures

Excellentelectricalproperties

Dielectricconstantlessthan3.5

Dissipationfactorlessthan0.010

Excellent,stableandflatDk/Dfperformance

CompatiblewithmostFR-4processes

PropertyTypicalValues

Tg(DMA)220°C

Tg(DSC)200°C

Tg(TMA)190°C

Td(TGA)340°C

CTEz-axis(50to260°C)2.5%

T-260/T28860min/20min

Permittivity(RC50%)

@10GHz

3.5

LossTangent(RC50%)

@10GHz

0.008

IndustryApprovals

ULDesignation-ANSIGrade:FR-4

ULFileNumber:E189572

FlammabilityRating:94V-0

MaximumOperatingTemperature:130°C

IPC-4101TypeDesignation:/29,/98,/99,/101,/126

StandardAvailability

Thickness:0.002”[0.05mm]to0.062”[1.58mm],availableinsheetorpanelform

CopperFoilCladding:1/3to5ozforbuilt-up&doublesides

Prepregs:Availableinrollorpanelform